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Industry News
How The PACK Challenge Builds Tomorrow’s Packaging Workforce

PMMI, The Association for Packaging and Processing Technologies: The halls of PACK EXPO International in Chicago reliably bustle with machine suppliers and CPGs connecting every two years. But a keen observer might notice a different kind of event unfolding inside the show; a high-stakes packaging competition among high school students, bridging the classroom and the manufacturing floor – The PACK Challenge.
Now in its third season, the competition challenges students to tackle real-world engineering problems.
